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HGT-421 小型基板自動研磨機
Mini scale Grinder for IC package and Ceramic substrate
適用範圍:
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各式導線架封裝溢膠去除de-flash。
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導線架封裝後膠帶殘膠去除residue。
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導線架封裝後電鍍前銅面活化處理。
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封裝後Molding Compound/EMC減薄。
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封裝後Molding Compound/EMC研磨露die。
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molding deflash溢膠移除
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de-tapping residue remove
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리드 프레임 디 플래시
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封止バリ取
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陶瓷基板素板減薄(ALN, ALO, Sapphire)。
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陶瓷基板鐳射熔渣去除。
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陶瓷基板電鍍後銅面整平、減薄。
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陶瓷基板防焊漆去除、整平。
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陶瓷基板銀膠塞孔研磨整平。
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各式基板特殊拋光。
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其他特殊研磨。
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陶瓷基板研磨
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リードフレームパッケージ
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デフラッシュ






Feature&Capability
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Small-scale economy grinding solution
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High UPH performance up to 300 Strips
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Various applications
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The high performance of quality and efficiency
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No de-lam problem.
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No Crack or break.
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No ESD
Function&Specification
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Product Width ➠60~150mm
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Process Speed ➠up to 2 m/min
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Function A ➠Ceramic substrate
Glass substrate, ALN substrate, etc.
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Function B ➠QFN / DFN / IPM / PPAK / MIS / Premold lead frame / Exposed heat sink / Any kind of LeadFrame package is able to experience grinding de-flash process.

AutoLoader
HGT Grinder
WDM Cleaner
AutoUnloader
Fully Auto process flow

Molding de-flash on QFN





Deburr after laser drilling



Grinding pattern leveling
Molding de-flash on Heat sink


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