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Quality·Efficiency·Expertise
- New: SPG Buffing and Polishing Machine. Contact us to discuss your requirements.
- New service: Two-Fluid Blasting. Contact us to discuss your requirements.
- New model: CFM-100 Compact Filtration Machine
- Latest product: Hyper Cleaner Adhesive Cleaning Board
- Latest consumable: RAD Anti-Sticking Resin-Removal Buff
- Substrate buffing and high-aspect-ratio resin hole-plugging services. Contact us to discuss your requirements.
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HGT Series | Automatic Buffing Machine
Automatic buffing equipment for IC packages and ceramic substrates, including package deflashing and ceramic-substrate copper-surface leveling and thinning.
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