Efficient Resin Removal
Designed for resin and residue removal, with high removal capability for processes requiring substantial resin removal.
RAD SERIES / RESISTED ADHESION DOUBLE-BONDED
RAD Anti-Sticking Resin-Removal Buff
An anti-sticking structure combines resin-removal efficiency, fine buffing and conformity to recessed surfaces for resin removal from ABF, extra-thick boards and PLP packaging.
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APPLICATION & FEATURES
Start with your application
Choose suitable materials
- ABF inner-layer vacuum-plug buffing
- Residual resin removal from low areas of extra-thick boards
- Bulk resin removal for PLP packaging
Anti-Sticking Structure
The special anti-sticking structure combines bulk resin removal and resistance to adhesion while maintaining stable cutting action.
Fine Brushed Surface
Produces fine, dense and uniform buffing marks for consistent surface buffing.
Uniform Contact with Recessed Surfaces
The buff conforms closely to recessed surfaces to improve buffing uniformity.
Custom Dimensions
Discuss buff dimensions for different equipment and workpieces, and assess a suitable grit for the process.
PRODUCT INFORMATION
Product Specifications
| Series | RAD |
|---|---|
| English name | Resisted Adhesion Double-Bonded |
| Type | Anti-Sticking Resin-Removal Buff |
| Grit | #320、#600、#800、#1500、#3000 |
| Structural method | Special anti-sticking structure |
| Dimensions | Customizable on request |
Confirm wheel diameter, bore and width for the equipment. Provide resin, workpiece and process details to assess grit and parameters. Actual resin removal and surface quality depend on materials and processing conditions.
Discuss your requirements with workpiece and process details.
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