01 / QFN package workpiece
QFN Package Deflashing
Molding flash remains on the workpiece surface after packaging and needs removal around the contacts.
The processed comparison shows the contacts and surrounding surface after deflashing.
IC PACKAGE & CERAMIC BUFFING
HGT Series | Automatic Buffing Machine
Automatic buffing equipment for IC packages and ceramic substrates, including package deflashing and ceramic-substrate copper-surface leveling and thinning.
HGT SERIES / Buffing Equipment
Workpieces and Requirements
- Leadframe-package deflashing
- Removal of tape residue after packaging
- Copper-surface leveling after ceramic-substrate electroplating
- Laser-slag removal from ceramic substrates
HGT / APPLICATION RESULTS
See the process through the workpiece
HGT series processing examples. Actual results depend on materials, workpieces and equipment configuration. These photographs do not represent HGT-421 specifications or performance.
02 / Laser-drilled substrate
Slag Removal After Laser Drilling
Removes residual slag around hole edges after laser drilling.
Before/after photographs compare the hole edges following slag removal.
03 / Patterned substrate surface
Patterned-Surface Buffing and Leveling
Buffing and leveling the patterned surface prepares the workpiece for subsequent processes.
The comparison shows changes to the patterned surface before and after buffing.