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Hole-Plug and Surface Processing
- Resin-plug buffing
- Screen-printed plug buffing
- Vacuum-plug buffing
- Photoresist-layer buffing
SUBSTRATE BUFFING
General Buffing Services
Substrate buffing, copper thickness reduction, fine surface leveling and special polishing. Suitable methods are assessed according to the workpiece and processing requirements.
GOTEX
Ask About This ServiceProcessing Applications
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Substrate Buffing
- Packaging substrates
- MIS substrates
- Ceramic substrates
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Metal and Special Processing
- Lamination steel-plate buffing
- Copper-pillar and copper-cap buffing
- Copper thickness reduction by buffing
- Special polishing and other special buffing
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Surface Processing
- Fine surface leveling
Processing Examples
High-Aspect-Ratio Resin Hole-Plugging Services
High-aspect-ratio resin hole-plugging services, with selective plugging and customized resin selection. Processing requirements are assessed according to the workpiece conditions.
Technical Information
- High aspect ratio 1：40
- Hole-recess defect rate ＜1%
- Bubble-free
- Clearly defined hole-plugging technology
Actual processing results depend on workpiece and process conditions.
START A CONVERSATION
Prepare these details for discussion
- Workpiece material
- Workpiece dimensions
- Current workpiece condition
- Processing goals
Please provide the workpiece material, dimensions, current condition and processing goals so we can assess a suitable method.