AUTO BUFFING MACHINE

DSM Series | Buffing Machine

For substrate leveling and pre- and post-processing, with automatic pressure adjustment and board-thickness detection for different buffing requirements.

DSM SERIES / Buffing Equipment

Display Model: DSM-220

For substrate leveling and pre- and post-processing, with automatic pressure adjustment and board-thickness detection for different buffing requirements.

Substrate leveling by buffing
Pretreatment for dry film and solder mask
Pre- and post-processing for PTH electroplating
Lamination-flash removal from steel plates by buffing

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APPLICATIONS

Start with the application

Processing suitability, dimensions and configuration require an assessment.
Please provide workpiece details for our technical team to review.

Substrate leveling by buffing

Pretreatment for dry film and solder mask

Pre- and post-processing for PTH electroplating

Lamination-flash removal from steel plates by buffing

Confirm the key conditions before selection

Provide workpiece information so we can confirm equipment dimensions, power supply, consumable configuration, lead time and quotation.

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